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Title:
TWO LIQUID TYPE ACRYLIC ADHESIVE FOR MANUFACTURING PATTERN OF CASTING MOLD, AND BONDING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2006122915
Kind Code:
A
Abstract:

To provide an acrylic adhesive to be used for joining components composing a disappearable casting pattern made of methacrylic resin foamed body, which acrylic adhesive (1) can reduce the generation of burnt dregs of the hardened adhesive, (2) is low in the solubility for the methacrylic resin foamed body, (3) can firmly join the components of the pattern, and (4) can join the components of the pattern in a short period of time.

The two liquid type acrylic adhesive contains (A) a polymeric monomer, (B) an organic peroxide, (C) a vanadium compound, and (D) an acidic phosphoric acid compound, wherein 80 mass% or more of (A) is a (meth)acrylate having a specified molecular structure and molecular weight.


Inventors:
ARAI YASUO
DOI HIDEMI
UMEKI TATSURO
NOGUCHI SHIROYUKI
Application Number:
JP2004310634A
Publication Date:
May 18, 2006
Filing Date:
October 26, 2004
Export Citation:
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Assignee:
CEMEDINE CO LTD
OKURA INDUSTRIAL CO LTD
KANEKA CORP
International Classes:
B22C7/02; C09J4/02; C09J5/04; C09J11/00
Domestic Patent References:
JPH09122822A1997-05-13
JPS63162776A1988-07-06
JP2002307133A2002-10-22
JPH07150113A1995-06-13
JPH06192633A1994-07-12
JPH09122822A1997-05-13
JPS63162776A1988-07-06
JP2002307133A2002-10-22
JPH07150113A1995-06-13
JPH06192633A1994-07-12
Attorney, Agent or Firm:
Yoshiyuki Kawaguchi
Hidemi Matsukura
Tsutomu Toyama



 
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