Title:
Ultra high molecular weight polyethylene cutting thin film
Document Type and Number:
Japanese Patent JP6357820
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrahigh-molecular weight polyethylene-made cutting thin film which is high in strength and excellent in wear resistance.SOLUTION: An ultrahigh-molecular weight polyethylene-made cutting thin film is formed by cutting from a molding using an ultrahigh-molecular weight polyethylene particle which meets conditions (1) to (3): (1) the intrinsic viscosity ([η]) is 15-60 dl/g; (2) the bulk density is 130-700 kg/m; and ΔTm(ΔTm=Tm-Tm), or the difference between the melting point (Tm) of the 1st scan and the melting point (Tm) of the 2nd scan, measured with a differential scanning calorimeter(DSC), is 11-30°C.
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Inventors:
Kei Inatomi
Naruhiko Abe
Naruhiko Abe
Application Number:
JP2014053362A
Publication Date:
July 18, 2018
Filing Date:
March 17, 2014
Export Citation:
Assignee:
Tosoh Corporation
International Classes:
C08J5/18; B29C43/02; B29C43/58; C08F110/02
Domestic Patent References:
| JP2011144297A | ||||
| JP2010532800A | ||||
| JP6220129A | ||||
| JP9291112A | ||||
| JP2012229417A | ||||
| JP4071830A | ||||
| JP2011121992A | ||||
| JP2003003019A | ||||
| JP2013227539A | ||||
| JP5070519A | ||||
| JP11236410A | ||||
| JP11513943A |
Foreign References:
| WO2008001772A1 | ||||
| WO2006070886A1 | ||||
| WO2012029881A1 |
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