UNSATURATED POLYESTER RESIN COMPOSITION, THERMOSETTING MOLDING MATERIAL AND PLASTIC MOLDING PRODUCT BY USE THEREOF

Title:

UNSATURATED POLYESTER RESIN COMPOSITION, THERMOSETTING MOLDING MATERIAL AND PLASTIC MOLDING PRODUCT BY USE THEREOF

Document Type and Number:

Japanese Patent JP2001040199

Kind Code:

A

Abstract:

To provide an unsaturated polyester resin composition capable of obtaining a thermosetting molding material having high gloss and high smoothness excellent in design and capable of coloring uniformly, excellent in curing property and having high hot water resistance.

An unsaturated polyester resin composition is constituted of dissolving the unsaturated polyester resin in a crosslinking monomer which contains each of (a) a mol 2,6-naphthelene dicarboxylic acid, (b) b mol α,β-unsaturated polybasic acid or its anhydride, (c) c mol saturated polybasic acid or its anhydride and (d) d mol polyalcohol as a material so that the compounding molar ratio, (a+b+c)/a/b/c/d is 1/0.05-0.5/0.5-0.95/0-0.45/0.7-1.3. A thermosetting molding material and a plastic molding product are obtained by curing the thermosetting molding material.

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Inventors:

NUMAO KAZUYUKI
ARAKAWA YUKUSHI
GO YUTAKA
SATO SHIGEJI

Application Number:

JP21059499A

Publication Date:

February 13, 2001

Filing Date:

July 26, 1999

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C08J5/00; C08F283/01; C08G63/52; C08L67/06; (IPC1-7): C08L67/06; C08F283/01; C08G63/52; C08J5/00

Attorney, Agent or Firm:

Kunihiko Wakabayashi

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