PURPOSE: To uniformize the film thicknes distribution of a formed vapor deposition film by controlling electron beam so as to always move the same to an optimum position, by inputting the measured thickness value of the vapor deposition film formed in an electron beam vapor depostion apparatus to an electron beam position control circuit and operating an electromagnetic deflection control circuit by the output thereof.

CONSTITUTION: The surface of the evaporation stock material comprising oxide such as Al2O3, SiO2 or MgO in a crucible 21 is accurately irradiated with electron beam 24 from an electron beam generating part 23 in the magnetic field due to an X-direction deflection coil 25 and a Y-direction deflection coil 26 and a vapor deposition film comprising the above mentioned oxide is formed to the surface of an object to be processed. The thickness of the vapor deposition film is measured by a sensor 28 and a measuring instrument 29 and the signal thereof is sent to a beam position control circuit 31 through an operation control circuit 32. The beam position control signal converted herein is fed back to an electromagnetic deflection control curcuit 27 and electron beam 4 is automatically moved to a position where an evaporation speed becomes high by both deflection coils 25, 26 and uniformly project the evaproation stock material to uniformize the film thickness distribution of the vapor deposition film on the surface of the object to be processed.