To provide a vapor deposition source which ensures uniform thickness of a film to be deposited, and high film deposition efficiency, and for which various kinds of film deposition material can be applied, and its film deposition method.

This invention relates to the vapor deposition source for vapor-depositing a film deposition material, and it includes a container having an aperture, a film deposition material storage unit for storing the film deposition material arranged in the container, and a heatable porous material part which is arranged between the film deposition material storage unit and the aperture of the vapor deposition source. The film deposition method using the vapor deposition source is also provided.