To provide a vapor drying apparatus that removes effectively and reproducibly moisture on a surface of a material to be dried such as an wafer, can inhibit adhesion of particles to the material to be dried and generation of watermarks or insufficient drying, and can be easily set up.
A vapor drying apparatus is used in a vapor drying process, where a washed material to be dried is exposed in an organic solvent vapor to condense the vapor on a surface of the material to be dried such that moisture left on the surface of the material to be dried is substituted by the organic solvent, which is then volatilized to dry the material to be dried. The vapor drying apparatus comprises a processing chamber accommodating the material to be dried and the vapor and a vapor introducing part, placed in the processing chamber, which has a hole through which the vapor is introduced to the surface of the material to be dried.
MATSUMURA TAMIO
| JPS63161623A | 1988-07-05 | |||
| JPH07254585A | 1995-10-03 |
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa
Masato Sasaki