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Patent Searching and Data


Title:
ワニスおよびその製造方法
Document Type and Number:
Japanese Patent JP7061944
Kind Code:
B2
Abstract:
To provide a resin composition with a small influence of melting temperature on the solubility of a resin composition into a low-boiling solvent, with improved solubility in a wide range of melting temperatures, and with excellent productivity.SOLUTION: The present invention provides a resin composition that is obtained by melting a resin mixture containing a (A) polymaleimide compound represented by formula (1) and (B) a phenolic resin, wherein, the average number nof repeating units of the (A) polymaleimide compound represented by formula (1), contained in the resin mixture, is 0.01 or more and 5 or less.SELECTED DRAWING: None

Inventors:
Kikuchi Shigenobu
Shinya Akimoto
Tatsuya Kawasaki
Shigeki Kawaguchi
Makino Shigeo
Application Number:
JP2018153425A
Publication Date:
May 02, 2022
Filing Date:
August 17, 2018
Export Citation:
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Assignee:
Printec Co., Ltd.
International Classes:
C08G59/40; C08L61/06; C08L63/00; C08L79/08; C09D161/06; C09D163/00; C09D179/08; C09J161/06; C09J163/00; C09J179/08; C09K3/10; H05K1/03
Domestic Patent References:
JP2016044208A
JP1266124A
Attorney, Agent or Firm:
Katsuyuki Okubo
Kaneko Ichiro