Title:
車両用ボード構造体及び車両用ボード構造体の製造方法
Document Type and Number:
Japanese Patent JP6884047
Kind Code:
B2
Abstract:
To provide a vehicle board structure which prevents occurrence of a problem of adhesive failure between a hinge sheet and a front surface material in a manufacturing process of the vehicle board structure.SOLUTION: A vehicle board structure 1 of the invention includes: a plate-like honeycomb body 14 having hollow cells therein; surface materials 13, 15 which are provided so as to close openings of the cells of the honeycomb body 14; a thermosetting resin 16 filling the hollow cells of the honeycomb body 14; hinge parts 11 which are formed by crushing parts of the honeycomb body 14 filled with the thermosetting resin; a hinge sheet 12 which is provided spanning between the hinge parts 11 at the outer side of the surface materials 13, 15; and openings 20 opened on the hinge sheet 12.SELECTED DRAWING: Figure 1
Inventors:
Kiichiro Suzuki
Hisashi Uno
Hisashi Uno
Application Number:
JP2017118547A
Publication Date:
June 09, 2021
Filing Date:
June 16, 2017
Export Citation:
Assignee:
Hayashi Telempu Co., Ltd.
International Classes:
B60R5/04; B32B3/12; B32B3/20; B32B5/02; B32B5/18
Domestic Patent References:
| JP2011011615A | ||||
| JP2009286817A | ||||
| JP5056429U | ||||
| JP55115826U | ||||
| JP2014046846A |
Foreign References:
| WO2014102867A1 | ||||
| WO2015025574A1 |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Masaaki Ogata