Title:
VIA AND PAD STRUCTURE BODY FOR THERMOPLASTIC SUBSTRATE, AND METHOD AND EQUIPMENT FOR FORMING THE STRUCTURE BODY
Document Type and Number:
Japanese Patent JP2500989
Kind Code:
B2
Abstract:
PURPOSE: To improve the conformity of a plurality of thin layers, and form via connection of high positioning precision by embedding at least a conductive element in a polymer material which is comparatively non-conductive, and generating a reflow of at least a part of the polymer material around the conductive element.
CONSTITUTION: A thermoplastic thin-film equipment for forming via connection has a thermoplastic substrate 100, a holding plate 12, a retaining plate or a die 14, a conductive ball 16 and a drive member 18. The conductive ball 16 is simply separated from the top surface of the holding plate 12 and can be mounted on the holding plate 12, by directly violently swinging the ball 16 from the movement of the holding plate 12, e.g. vibration, or by using a wiper or a squeegee, or with gas or gluid pressure. Thereby the positioning of the ball is enabled with practically the same precision as the precision of the holding plate 12, and moreover this positioning precision can be repeated.
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Inventors:
HAABAATO ANDAASON
AASAA BUROSU
JUURIAN JOOJI SENPA
ROBAATO OOTEISU RUTSUSO
DONARUDO EDOWAADO MAIAAZU
TOMASU JEI UORUSHU
AASAA BUROSU
JUURIAN JOOJI SENPA
ROBAATO OOTEISU RUTSUSO
DONARUDO EDOWAADO MAIAAZU
TOMASU JEI UORUSHU
Application Number:
JP4818293A
Publication Date:
May 29, 1996
Filing Date:
March 09, 1993
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
B29C65/70; H01R12/04; H01R43/20; H05K1/11; H05K3/00; H05K3/36; H05K3/40; H05K3/46; (IPC1-7): H05K3/40; H01R9/09; H01R43/20; H05K1/11; H05K3/46
Domestic Patent References:
| JP464277A | ||||
| JP6461087A |
Attorney, Agent or Firm:
Chika Takagi (2 outside)