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Title:
VIBRATION DAMPING MATERIAL
Document Type and Number:
Japanese Patent JP2010121688
Kind Code:
A
Abstract:

To provide a vibration damping material 10 which is lightweight, which has high vibration damping property, which can easily be formed into a film by an extrusion molding method during manufacture, and which can easily be glued by adhesion or thermobonding during use.

The vibration damping material consists of at least a vibration damping layer 11 and an adhesion layer 13. In this material, the vibration damping layer 11 contains (A) 20-50 pts.wt. of a polyester resin composed of a dicarboxylic acid component unit and a diol component unit, (B) 50-80 pts.wt. of mica pieces, (C) 0.1-20 pts.wt. of conductive carbon powder, and (D) a styrene-based thermoplastic elastomer. A content ratio of (A)+(B)+(C):(D) is 100:50-900 pts.wt. on the basis of mass and the thickness of the vibration damping material 10 is 2 mm or less.


Inventors:
KUROKI JUNICHI
UEKI TAKAYUKI
YAGI IZUMI
Application Number:
JP2008295073A
Publication Date:
June 03, 2010
Filing Date:
November 19, 2008
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
F16F15/02; B32B25/08; B32B27/20; C08K3/04; C08K3/34; C08L53/02; C08L67/02; C09J125/08
Attorney, Agent or Firm:
Satoshi Kanayama
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto



 
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