Title:
振動センサ及びセンサモジュール
Document Type and Number:
Japanese Patent JP7027252
Kind Code:
B2
Abstract:
A vibration sensor according to an embodiment includes a laminated body. The laminated body includes a support layer a first end of which is fixed; a piezoelectric layer on the support layer; an insulating layer disposed between the support layer and the piezoelectric layer; a common electrode disposed on a first principal surface of the piezoelectric layer; a first sensing electrode disposed in a first area on a second principal surface of the piezoelectric layer on the side opposite to the first principal surface; and a drive electrode disposed in a second area different from the first area on the second principal surface of the piezoelectric layer. The first area is located near the first end of the support layer.
Inventors:
Li Yongfang
Application Number:
JP2018100554A
Publication Date:
March 01, 2022
Filing Date:
May 25, 2018
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L41/113; B81B3/00; G01H11/08; G01P15/09; G01P21/00; H01L41/047; H01L41/08; H01L41/083; H01L41/187; H01L41/29
Domestic Patent References:
| JP2016092089A | ||||
| JP2015081771A | ||||
| JP2010165341A | ||||
| JP2017181164A |
Foreign References:
| WO2013018788A1 | ||||
| WO2018020639A1 |
Attorney, Agent or Firm:
Sakai International Patent Office