Title:
VISCO-ADHESIVE COMPOSITION, VISCO-ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008133331
Kind Code:
A
Abstract:
To provide a visco-adhesive composition which can achieve high package reliability, even when exposed to a severe reflow condition in a package in which a thin semiconductor chip is mounted.
This visco-adhesive composition related to the present invention is characterized by comprising an acrylic polymer (A), an unsaturated hydrocarbon group-having epoxy thermosetting resin (B), a thermosetting agent (D), and a photopolymerization initiator (E).
Inventors:
SAEKI NAOYA
ICHIKAWA ISAO
SHIZUHATA HIRONORI
YAMAZAKI OSAMU
ICHIKAWA ISAO
SHIZUHATA HIRONORI
YAMAZAKI OSAMU
Application Number:
JP2006319231A
Publication Date:
June 12, 2008
Filing Date:
November 27, 2006
Export Citation:
Assignee:
LINTEC CORP
International Classes:
C09J133/00; C09J7/02; C09J163/10; H01L21/301; H01L21/52
Domestic Patent References:
| JP2001011411A | 2001-01-16 | |||
| JPH0232181A | 1990-02-01 | |||
| JPH0883655A | 1996-03-26 | |||
| JPH08239636A | 1996-09-17 |
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Koji Makimura
Chihata Takahata
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