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Title:
VLNYL CHLORIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS57117554
Kind Code:
A
Abstract:

PURPOSE: A non-rigid polymer composition useful as electric wires in apparatus of computers, haveing low aging properties under heating, and improved heat resistance, obtained by subjecting vinyl chloride resin with a specific alkyl(meth) acrylate and acrylonitrile to graft copolymerization.

CONSTITUTION: 100pts.wt. vinyl chloride resin, preferably resin having a degree of polymerization of 500W5,000 by suspension polymerization, is subjected to graft polymerzation (advantageously radical polymerization) with 35W90pts.wt. alkyl(meth)acrylate having a second-order transition point of ≤-10°C in the presence of 2W50pts.wt. acrylonitrile preferably at 30W100°C for 1W10hr in an inert gas atmosphere containing no oxygen.


Inventors:
OKADA HIROSHI
ISAKA TAKASHI
Application Number:
JP213381A
Publication Date:
July 22, 1982
Filing Date:
January 12, 1981
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08F259/00; C08F259/04; C08L1/00; C08L7/00; C08L21/00; C08L23/00; C08L27/00; C08L51/00; C08L51/02; C08L101/00; (IPC1-7): C08F259/04; C08L51/00
Domestic Patent References:
JPS56163108A1981-12-15



 
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