Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
VOLUME REDUCING METHOD OF RESIN MOLDING
Document Type and Number:
Japanese Patent JPH09235406
Kind Code:
A
Abstract:

To reduce the volume of a resin molding such as a foamed polystyrene in a simple process and also prevent the contamination of the resin molding after volume reduction.

In reducing the volume of a resin molding such as a foamed polystyrene, the resin molding 5 is heated to reduce its volume with a high temp. liquid as a heat source, where, as a heat source, a high temp, and a high b.p. liq. 2 having a b.p. of not less than 423K and a specific gravity of not less than 0.8 and a vapor pressure at drying temp. of not less than 20mmHg, e.g. a highly fluorinated compd. or low molecular polyorganosiloxane, is used. The resin molding 5 is, after thermal melting, taken out by cooling and solidifying or as a heat shrunken material by heat shrinking.


Inventors:
INADA MINORU
IMASHIRO YASUTAKA
KIMOTO KOREHIKO
SAITO NOBUHIRO
Application Number:
JP4366296A
Publication Date:
September 09, 1997
Filing Date:
February 29, 1996
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA CORP
UEKI CORP KK
TOSHIBA SILICONE
International Classes:
C08J11/20; (IPC1-7): C08J11/20
Attorney, Agent or Firm:
Suyama Saichi