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Title:
WAFER CARRIER HAVING IMPROVED PROCESSING CHARACTERISTIC
Document Type and Number:
Japanese Patent JP2010103554
Kind Code:
A
Abstract:

To provide a wafer carrier which is suitable for improved processing operations that provide improved device yield and low defectivity.

The wafer carrier 1 for supporting a plurality of wafers vertically includes at least first, second, and third support members 10, 12 and 14, and a plurality of slots 16 for receiving the plurality of wafers. The first, the second, and the third support members 10, 12 and 14 are provided so as to support and contact the wafers, and each slot is made up of first, second and third slot segments 18, 20 and 22, respectively, each of which respectively being extended along the first, the second and the third support members 10, 12, and 14. A cradle 2 is comprised of silicon carbide and has an oxide layer covering the silicon carbide.


Inventors:
BUCKLEY RICHARD F
HAERLE ANDREW G
CHANG HAN C
Application Number:
JP2009295992A
Publication Date:
May 06, 2010
Filing Date:
December 25, 2009
Export Citation:
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Assignee:
SAINT GOBAIN CERAMICS
International Classes:
H01L21/673
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta



 
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