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Patent Searching and Data


Title:
WAFER CHUCK
Document Type and Number:
Japanese Patent JPS6214434
Kind Code:
A
Abstract:

PURPOSE: To easily carry in or carry out wafers without complicating the internal structure of a wafer chuck by a method wherein the lifting mechanism is separated into the wafer-lifting member and the lift-driving means.

CONSTITUTION: The lifting mechanism is separated into a wafer-lifting member and a lift-driving means B, which moves the member A up and down. The lifting member (the base side part A consisting of a fork 5 and energizing springs 9) is mounted to a base 3 which is the wafer 1 mount used as the wafer chuck, and the lift-driving means (the driving means B consisting of thrusting-up pins 10, a bearing 11, a V roller 13 and a helicoid spring 14) is mounted on the side of a stage 12 supporting the base. By this constitution, the lift-driving source can be provided outside the wafer chuck or the vertically moving mechanism of the wafer chuck itself can be commonly used as the lift-driving source.


Inventors:
DEGUCHI SHINKICHI
IMAI SHUNZO
SATO TERUYA
Application Number:
JP15237385A
Publication Date:
January 23, 1987
Filing Date:
July 12, 1985
Export Citation:
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Assignee:
CANON KK
International Classes:
H01L21/683; B23Q3/06; H01L21/66; (IPC1-7): B23Q3/06; H01L21/66
Attorney, Agent or Firm:
Tatsuo Ito