Title:
ウェーハ検出装置、ウェーハ検出方法、及びプローバ
Document Type and Number:
Japanese Patent JP7382560
Kind Code:
B2
Abstract:
To provide a wafer detection device and a wafer detection method capable of both accurately determining the occurrence of a detection error and preventing a decrease in throughput, and a prober including the wafer detection device.SOLUTION: A wafer detection device includes a detection sensor that detects a wafer, a scanning mechanism that scans the detection sensor at a first speed in the first direction along a wafer accommodation position for each wafer in a cassette, a determination unit that determines the presence or absence of a detection error by the detection sensor on the basis of the detection result of the detection sensor while scanning in the first direction, and a scanning control unit that controls the scanning mechanism to rescan the detection sensor in the first direction at a second speed that is a predetermined second speed and in which the probability in which the determination unit erroneously determine whether a detection error has occurred is lower than the first speed when the determination unit determines that a detection error has occurred.SELECTED DRAWING: Figure 4
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Inventors:
Takashi Ishimoto
Hiroki Iijima
Hiroki Iijima
Application Number:
JP2022186988A
Publication Date:
November 17, 2023
Filing Date:
November 24, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/677; H01L21/67
Domestic Patent References:
| JP2004165543A | ||||
| JP1315156A | ||||
| JP2000150624A | ||||
| JP2006294642A | ||||
| JP2013143425A | ||||
| JP3169676U | ||||
| JP2017174899A |
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura