Title:
WAFER DRYING DEVICE AND MIST SPRAY DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3553430
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate the fact that liquid-phase isopropyl alcohol(IPA) falls through in the space of the spray part of a mist spray device for a wafer drying device.
SOLUTION: A mist spray device for a wafer drying device is provided with a spray part 301 which is formed with nitrogen feeding passages 304 and a light-phase IPA feeding passage 306 in its interior, and makes mist-shaped IPA which is formed by a method wherein after liquid-phase IPA enters inside the interior of the part 301 through the passage 306, nitrogen gas is mixed with the liquid-phase IPA, spray and is constituted of a porous material. The mist-shaped IPA of a temperature higher than that of a wafer is made to spray.
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Inventors:
Reina Sumi
Takanori Kawanishi
Tokuo Maeda
Awaihara Dai
Masao Ohno
Naoaki Izumitani
Takanori Kawanishi
Tokuo Maeda
Awaihara Dai
Masao Ohno
Naoaki Izumitani
Application Number:
JP25149199A
Publication Date:
August 11, 2004
Filing Date:
September 06, 1999
Export Citation:
Assignee:
Toho Kasei Co., Ltd.
Daikin Industries, Ltd.
Daikin Industries, Ltd.
International Classes:
B08B3/04; B05B7/04; F26B7/00; F26B21/14; H01L21/304; (IPC1-7): H01L21/304; B05B7/04; B08B3/04; F26B7/00; F26B21/14
Domestic Patent References:
| JP3057218A | ||||
| JP5138082A | ||||
| JP11087303A | ||||
| JP2000223466A |
Attorney, Agent or Firm:
Aoyama Aoi
Osamu Kawamiya
Mitsuo Wada
Osamu Kawamiya
Mitsuo Wada
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