WAFER END PART PROCESSING DEVICE

Title:

WAFER END PART PROCESSING DEVICE

Document Type and Number:

Japanese Patent JP3664894

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To process the end part of a wafer by a simplified device.
SOLUTION: This device is provided with a table 2 to rotate by sucking and holding a wafer 3; a unit holding member 6 provided at the upper side of the table 2; a linear shaft 11 provided movable up and down to the unit holding member 6; a pad holder 14 provided at the lower end of the linear shaft 11 through a spherical bearing 13; a ring form pad 20 fixed to the pad holder 14 corresponding to the end of the wafer 3; a cylinder 31 provided to the unit holding member 6, to press the pad holder 14, and a specific pressure to press the wafer 3 by the pad 20 is applied; and a cylinder 33 to feed a slurry on the wafer 3 at the inner side of the pad 20.

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Inventors:

Muto Nei
Shinji Tsuji

Application Number:

JP31031898A

Publication Date:

June 29, 2005

Filing Date:

October 30, 1998

Export Citation:

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