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Patent Searching and Data


Title:
WAFER HOLDING MECHANISM
Document Type and Number:
Japanese Patent JPH10189700
Kind Code:
A
Abstract:

To realize a wafer holding mechanism which are capable of surely performing a clamping/unclamping action, dispensing with an installation space, making the pinching pawls function surely synchronize with each other, easily regulating a clamping pressure, and generating less dust by a method wherein the pinching pawls are moved by the action of a multi-apex cam at the same time.

A pentagonal cam 2 which is possessed of apexes on its outer circumference and recesses each located between the two adjacent apexes and capable of pivoting to a base 5, an energizing means which energizes a movable pawl toward a wafer pinching side making it bear against the outer circumference of the pentagonal cam 2, a swing arm 7 which rotates the pentagonal cam 2 in one direction and rotates reversely in the opposite direction for recovering so as to move the bearing point of the pentagonal cam 2 which the movable pawl bears against between the apex and recess, and a pull-push wire 1 are provided. The movement of the cable core of the pull-push wire 1 in the lengthwise direction is changed to the movement of the swing arm 7, then the movement of the swing arm is changed to the rotary motion of the pentagonal cam 2, and then the rotary motion of the pentagonal cam 2 is changed to the rectilinear movement of the pinching pawls for chucking or unchucking a wafer.


Inventors:
NIINA SHUJI
Application Number:
JP34071196A
Publication Date:
July 21, 1998
Filing Date:
December 20, 1996
Export Citation:
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Assignee:
SONY CORP
International Classes:
B25J15/08; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B25J15/08