To provide a wafer inspection system which has a plurality of optical axes and is adapted to inspect a plurality of solid-state imaging devices for one time of wafer positioning, and saves more troubles than in a conventional case in inspection work even if a wafer to be inspected is replaced to change gaps between aligned solid-state imaging devices.

In the wafer inspection system U, inspection light is projected on the wafer 1, on the surface of which a number of solid-state imaging devices 2 are aligned to have a given gap therebetween, to inspect the solid-state imaging devices 2. The system U includes a plurality of split portions of an optical fibers 14 for projecting the inspection light, holding members L, R which hold respective projects of the split portions of optical fibers 14 opposite to the surface of the wafer 1, and a gap adjusting mechanism 50 (90) which holds the holding members L, R in alignment and moves them parallel to the surface of the wafer 1 to adjust the alignment gap between the holding members L, R. When the optical fiber 14 consists of three or more split portions, the gap adjusting mechanism 50 (90) is provided with a mechanism MC (PM) capable of adjusting the holding members L, R while keeping their alignment gap equal.