Title:
WAFER MOUNTING TABLE
Document Type and Number:
Japanese Patent JP2019040939
Kind Code:
A
Abstract:
To provide a wafer mounting table of such structure that the problems of breakdown due to thermal stress is less likely to occur.SOLUTION: In a ceramic wafer mounting table having a discoid ceramic base material 12 having a wafer mounting surface on the upper side, conductor circuits such as a resistance heating element 13, an RF electrode circuit 14, and the like, embedded in the ceramic base material 12, and electrode terminals 15, 16 having one ends for connection with these conductor circuits and the other end projecting from the lower side of the ceramic base material 12, the electrode terminals 15, 16 have a structure where more than two metal pieces 15a-15c, 16a-16c of different materials are coupled, and these metal pieces 15a-15c, 16a-16c are juxtaposed suitably in the ascending order of heat expansion coefficient, i.e., in the order of the first metal consisting of tungsten or molybdenum, the second metal of niobium, and a third metal where nickel or iron is the chief ingredient, from the connection part with the conductor circuit.SELECTED DRAWING: Figure 2
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Inventors:
SHIMAO DAISUKE
MIKUMO AKIRA
ITAKURA KATSUHIRO
KIMURA KOICHI
MIKUMO AKIRA
ITAKURA KATSUHIRO
KIMURA KOICHI
Application Number:
JP2017160170A
Publication Date:
March 14, 2019
Filing Date:
August 23, 2017
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L21/683
Attorney, Agent or Firm:
Noriyuki Tsujikawa