To provide a wafer polishing device preventing particles from being attracted on a wafer or a harmful effect from being given on a device formed on the wafer by preventing electrostatic charge phenomenon of a protecting sheet or a retainer ring caused by friction with the wafer during washing of a wafer carrier or polishing of the wafer.

The protecting sheet 24 contacting the wafer W of the wafer carrier 20 is made of conductive material or is applied antistatic treatment thereon to prevent electrostatic charge phenomenon of the protecting sheet 24 caused by friction with the wafer W during washing of the wafer carrier or polishing of the wafer. In addition to antistatic of the protecting sheet 24, movement of the wafer W in a radial direction is regulated and the retainer ring 23 having the protecting sheet 24 provided thereon is made of conductive material or is applied antistatic treatment thereon, electrostatic charge phenomenon of the protecting sheet 24 is prevented further.