Title:
WAFER POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3453977
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer polishing device capable of stably providing wafers having excellent flatness.
SOLUTION: This wafer polishing device has a surface plate 3 over which abrasive cloth 2 is stretched, a polishing head 4 provided above a position off the center of the surface plate 3, and a plate 7 installed below the polishing head 7; on the plate 7, a carrier 6 provided with a backing pad 12 for pressing a wafer W and designed to be capable of carrying the plurality of wafers W is provided in such a way as to be freely rotatable with respect to the plate 7, so that the wafer W is polished as it is rotated around the plate 7 while revolving on its own axis.
Inventors:
Fumihiko Hasegawa
Makoto Kobayashi
Fumio Suzuki
Makoto Kobayashi
Fumio Suzuki
Application Number:
JP35398795A
Publication Date:
October 06, 2003
Filing Date:
December 28, 1995
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B37/04; B24B37/27; B24B37/28; B24B37/30; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP758066A | ||||
| JP59169758A | ||||
| JP623664A | ||||
| JP7136927A | ||||
| JP6235761U |
Attorney, Agent or Firm:
Yoshio Arafune
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