Title:
WAFER POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3731411
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer polishing device provided with a detection device to detect a polish terminating point based on the change in the rotational resistance of a wafer during the polishing operation, and capable of correctly detecting the polish terminating point.
SOLUTION: A head body 22 and a carrier 24 to constitute a wafer holding head 14 are connected to each other through a connection bar 80, and a strain gauge 96 is provided on this connection bar 80. Since the rotational torque of the carrier 24 is detected by detecting the distortion in the horizontal direction of the connection bar 80 by this strain gauge 96, the polish terminating point can be detected correctly.
Inventors:
Minoru Numamoto
Application Number:
JP28856299A
Publication Date:
January 05, 2006
Filing Date:
October 08, 1999
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B37/013; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP10256209A | ||||
| JP10156711A | ||||
| JP8243917A | ||||
| JP1133902A | ||||
| JP11042555A |
Attorney, Agent or Firm:
Kenzo Matsuura
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