To provide a wafer polishing fixture which protects a rear surface of the wafer from being marred when a wafer is separated therefrom after polishing, and also to provide a method of manufacturing the fixture.

The wafer polishing fixture 1 has a flat surface 2 on which the wafer 5 is mounted and a roundly curved surface on the periphery of the flat surface 2. Further the wafer polishing fixture 1 is assumed to have a specified line A passing through a boundary between the flat surface 2 and the curved surface 3 as a tangent to the curved line, and an angle θ which the specified line A forms with the flat surface 2 is set to 3° or less, whereby the boundary between the flat surface 2 and the curved surface 3 forms a smooth curved profile without an edge.