Title:
WAFER PROCESSING METHOD AND PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2022064089
Kind Code:
A
Abstract:
To provide a new technique for suppressing the occurrence of defects caused by the protrusion of a protective tape that protrudes from the surface of a wafer whose diameter has been reduced by backside grinding.SOLUTION: A processing method for a wafer W with a chamfered portion Wm formed on the outer circumference includes a tape attachment step of attaching a protective tape T to a front surface Wa of a wafer W and making the diameter of the protective tape T the same as the diameter of the wafer W, a holding step of holding the wafer W by a holding table 10 via the protective tape T to expose a back surface Wb, a grinding step of grinding the back surface Wb of the wafer W held by the holding table 10 with a grinding wheel 23a to reduce the thickness of the wafer W to be thinner than half of the original thickness to form a protruding portion Tm in which the diameter of the wafer W is reduced and the protective tape T protrudes from the wafer W, and a shrinkage step of heating and shrinking the protruding portion Tm of the protective tape 10 after performing the grinding step.SELECTED DRAWING: Figure 6
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Inventors:
MATSUOKA YUYA
Application Number:
JP2020172605A
Publication Date:
April 25, 2022
Filing Date:
October 13, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B24B7/04; B24B55/06
Attorney, Agent or Firm:
Hiroshi Ogami