Title:
ウェーハの加工方法
Document Type and Number:
Japanese Patent JP5356890
Kind Code:
B2
Abstract:
A wafer processing method of dividing a wafer into individual devices, the wafer having on a front surface a device area and an external circumferential redundant area surrounding the device area, the method including: a wafer grinding step in which, in the state where the wafer is held on the side of a protection tape stuck to the front surface of the wafer, a rear side of the device area in a rear surface of the wafer is ground to form a recessed portion to form a ringlike reinforcing portion on an outer circumferential side of the recessed portion; a metal film coating step for coating, with a metal film, a rear surface of the wafer stuck with the protection tape on the front surface; and a wafer dividing step for cutting the predetermined dividing lines from a rear surface side of the wafer stuck with the protection tape on the front surface, thereby dividing the wafer into the individual devices.
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Inventors:
Karl Priwassa
Application Number:
JP2009090166A
Publication Date:
December 04, 2013
Filing Date:
April 02, 2009
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; H01L21/304
Domestic Patent References:
| JP2008258417A | ||||
| JP2007150048A | ||||
| JP2008244375A | ||||
| JP2008187153A | ||||
| JP2007200917A |
Attorney, Agent or Firm:
Isao Sasaki
Kyoko Kawamura
Ken Kubo
Kyoko Kawamura
Ken Kubo