Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ウエーハの加工方法
Document Type and Number:
Japanese Patent JP5357669
Kind Code:
B2
Abstract:
The method involves arranging an adhesive tape at an upper end of a circular reinforcement section of a semiconductor wafer (11), and rotating a roller at a rear side (11b) of the adhesive tape against the wafer by downward force. The reinforcement section is downwardly pressed for separating the reinforcement section from a circular recess along a circularly modified layer and attaching the adhesive tape at a lower surface of the recess and an upper end of the reinforcement section. A protective band is removed from the wafer, and the reinforcement section is removed from the adhesive tape.

More Like This:
JP7214320Wafer processing method
JP6756398Adhesive tape
JP5637332Manufacturing method of semiconductor pieces, circuit boards and electronic devices containing semiconductor pieces, and dicing method of boards
Inventors:
Karl Priwassa
Gerald Krug
Application Number:
JP2009197943A
Publication Date:
December 04, 2013
Filing Date:
August 28, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B1/00; H01L21/304
Domestic Patent References:
JP2007096010A
JP2009081391A
JP2008283025A
JP2006269507A
JP2008053341A
Attorney, Agent or Firm:
Akira Matsumoto
Kenji Ito



 
Previous Patent: JPS5357668

Next Patent: METHOD OF PREVENTING BRDIGE FORMATION OF GRANULAR MATERIAL IN GRANULAR MATERIAL RESERVING TANK