Title:
WAFER STAGE WITH CUT GROOVE
Document Type and Number:
Japanese Patent JPH04286141
Kind Code:
A
Abstract:
PURPOSE: To easily grasp a wafer by wafer forceps by providing a cut groove on a surface of a wafer stage in mounting the wafer on the surface of the stage in a probe.
CONSTITUTION: A cut groove having 65.4mm of a length, 20mm of a width and 3mm of a depth is provided along a center line of a longitudinal direction on a surface 2 of a wafer stage of a probe. Since a wafer 1' can be easily grasped by wafer forceps by providing the groove on the surface 2 of the stage of the probe, the wafer can be simply mounted.
Inventors:
SUZUKI KENJI
Application Number:
JP4985391A
Publication Date:
October 12, 1992
Filing Date:
March 14, 1991
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
G01R31/26; H01L21/66; (IPC1-7): G01R31/26; H01L21/66
Attorney, Agent or Firm:
Keinosuke Hayashi