WAFER TREATMENT AND TREATING DEVICE THEREOF

Japanese Patent JPS59218730

A

PURPOSE:To shorten the treating time at each treating position and to contrive the increasing of mass productivity by a method wherein wafer treatment is successively performed in parallel at two treating positions. CONSTITUTION:A semiconductor wafer 12 carried in a first treating container 10 by an appropriate conveying means from the previous process is vacuum-attracted on a first spinner 14 and an developing solution, for example, a positive type resist developing solution 16, is dripped on the wafer 12 from a developing nozzle 15. At this time, the first spinner 14 is rotated at a comparatively low speed for a short time only. The wafer 12 dripped the developing solution 16 in such a way is carried in a second treating container 11 from the first treating container 10 by a conveying mechanism 17 and a guide supporting member 18, being kept as the wafer 12 has placed the developing solution 16 thereon. The wafer 12 in the second treating container 11 is supported the lower side thereof by a second spinner 19 and is rotated along with the second spinner 19 by a motor 20 when a rinsing solution is supplied on the wafer 12 from a rinsing nozzle 21. After that, by stopping the supply of rinsing solution and making the wafer 12 rotate at a high speed, the wafer content attached on the wafer 12 is scattered from the wafer 12 by the centrifugal power and the wafer 12 is dried.

JP3849921	BOARD TREATMENT APPARATUS
JP2000195933	SPINNER CHUCK
JPS63193525	ROTARY TABLE FOR SPINNER

KOTANI TETSUJIROU
KIYOTA SHIYOUGO
NANKOU SUSUMU

JP9236983A

December 10, 1984

May 27, 1983

Click for automatic bibliography generation  

HITACHI LTD
HITACHI OME ELECTRONIC CO

B05C11/08; B05D1/40; G03F7/30; H01L21/027; H01L21/30; (IPC1-7): H01L21/30; B05C11/08; G03F7/00

Akio Takahashi

Previous Patent: PROJECTION EXPOSING DEVICE

Next Patent: METHOD FOR WASHING SEMICONDUCTOR WAFER