Title:
WAFER WASHING METHOD
Document Type and Number:
Japanese Patent JPH0677202
Kind Code:
A
Abstract:
PURPOSE: To sharply improve the cleanness of wafer surface.
CONSTITUTION: In a wafer washing method in which a wafer is washed by pure water in the final process and then the wafer is dried up by vapor, the pure water used to wash the wafer is cooled. As a result, the amount of condensation of a vapor solvent can be increased.
Inventors:
OZAWA MAKOTO
ONISHI MASAYA
KOMATA CHIKAFUMI
AKIYAMA HIROKI
ONISHI MASAYA
KOMATA CHIKAFUMI
AKIYAMA HIROKI
Application Number:
JP22975292A
Publication Date:
March 18, 1994
Filing Date:
August 28, 1992
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01L21/304; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Takashi Matsumoto
Next Patent: DRYING TREATMENT DEVICE