Title:
WAFER WITH SCRIBE LINE, AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04215456
Kind Code:
A
Abstract:
PURPOSE: To prevent etching failure and maintain wafer strength when scribe lines are formed in a silicon wafer by anisotropic etching.
CONSTITUTION: Scribing grooves are separated from one another at their crossings on a {100} wafer. These grooves include {111} boundaries and take a V-shape. The transfer mask for forming the grooves has a mask pattern that forms guides separated from one another at crossings of etching guide masks.
Inventors:
NAKAMURA HAJIME
Application Number:
JP41064090A
Publication Date:
August 06, 1992
Filing Date:
December 14, 1990
Export Citation:
Assignee:
NIKON CORP
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Masatoshi Sato