防水構造 - Hayakawa Rubber Co., Ltd.

Title:

防水構造

Document Type and Number:

Japanese Patent JP7199055

Kind Code:

B2

Abstract:

To maintain waterproof performance at low cost and over a long period of time.SOLUTION: The waterproof structure includes a heat insulating panel 12 in which a plurality of places are fastened and fixed to a deck plate 10, and a synthetic resin waterproof sheet 15 laid on the upper surface of the heat insulating panel 12. The heat insulating panel 12 includes a heat insulating material 12a and a metal cover 12b having a covering material. The lower surface of the heat insulating panel 12 is configured so that the heat insulating material 12a is exposed.SELECTED DRAWING: Figure 1

Inventors:

Takanori Maruko
Fujii Kozo
Yasuhiro Ittanda
Atsuo Shimizu

Application Number:

JP2018217903A

Publication Date:

January 05, 2023

Filing Date:

November 21, 2018

Export Citation:

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