Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WELD BONDING EQUIPMENT
Document Type and Number:
Japanese Patent JP3709383
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To conduct weld bonding on an annular part of a material and on a part along the long direction of cylindrical material continuously by means of ultrasonic heating with a single equipment.
SOLUTION: A sheet material is heat bonded by a heating means while it is fed in between a pair of rollers and squeezed with the rollers. The rollers comprise a common roller 3, a first roller 16 and a second roller 21, where the latter two being pressed against the common roller 3. The first roller 16 is set on an end of cylinder 10 arranged across the traveling direction of the material 36 and the second roller 21 is set on an end of an arm 11 arranged along the traveling direction of the material. The cylinder 10 or 11 is turned to press the first or second roller 16 or 21 selectively against the common roller 3. The heating means comprises a horn 30 which applies ultrasonic vibration to the material.


Inventors:
Kozo Nakao
Noritaka Taguchi
Kazuo Fujita
Application Number:
JP2002138040A
Publication Date:
October 26, 2005
Filing Date:
May 14, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Quinlite Electronic Seiko Co., Ltd.
International Classes:
B29C65/08; B29L31/52; (IPC1-7): B29C65/08
Domestic Patent References:
JP59165622A
JP59165621A
JP5667945U
Attorney, Agent or Firm:
Koichi Suzue
Shoji Suzue