Title:
WINDOW GLASS FOR SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3532178
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide window glass for a semiconductor package, which can suppress the mixture of U and Th which become main α-ray generating sources in the glass.
SOLUTION: This window glass is composed of borosilicate glass containing SiO2 in an amount of 50-78%, B2O3 in an amount of 5-25%, Al2O3 in an amount of 0-3.6%, Li2O in an amount of 0-5%, Na2O in an amount of 0-18%, and K2O in an amount of 0-20% so that the total amount of Li2O, Na2O, K2O may become 5-20% and the total amount of SiO2, Ba2O3, Al2O3, Li2O, Na2O, and K2O may become ≥80% and has a coefficient of thermal expansion of 45×10-7 K-1 to 75×10-7 K-1, The borosilicate glass contains U and Th in amounts of ≤5 ppb, respectively.
Inventors:
Sagara, Hiroharu
Application Number:
JP2001323153A
Publication Date:
May 31, 2004
Filing Date:
April 28, 1995
Export Citation:
Assignee:
HOYA CORP
International Classes:
C03C3/089; C03C3/091; C03C3/093; C03C3/095; C03C3/17; C03C4/08; H01L23/02; H01L23/08; H01L27/14; (IPC1-7): H01L27/14; C03C3/089; C03C3/091; C03C3/093; C03C3/17; C03C4/08; H01L23/02
Attorney, Agent or Firm:
中村 静男