To carry out slicing work by a wire saw by covering an outer peripheral surface of a conductor of high strength applied with coppering with a resin bond layer containing abrasive particulates of a specific grain diameter and a filler in resin having a specific elastic modulus and softening temperature.
A conductor 2 is made by applying coppering on a piano wire. Abrasive particulates 3 are fastened on an outer peripheral surface of this conductor 2 of high strength by a resin bond 5 layer. As these abrasive particulates 3, super-abrasive particulates like diamond are favourable, and those of more than 2/3 of thickness of the resin bond 5 layer and less than 1/2 of a diameter of the conductor 2 are used. Additionally, as resin bond 5, resin an elastic modulus of which is more than 100 kg/mm2 and softening temperature of which is more than 200°C and in which a filler 4 a grain diameter of which is less than 2/3 of thickness of the resin bond 5 layer is included is used. Fastening power of the conductor 2 and the resin bond 5 layer is improved and flexibility is also improved by carrying out surface treatment applied on the conductor 2 by coppering.
SUGAWARA JUN
YAMANAKA MASAAKI
OGAWA HIDEKI
URAKAWA NOBUO
OSAKA DIAMOND IND
Next Patent: ROLL CHOCK CONSTRAINING DEVICE