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Patent Searching and Data


Title:
WIRING BOARD HOLDING DEVICE
Document Type and Number:
Japanese Patent JP2002064298
Kind Code:
A
Abstract:

To efficiently perform a cream solder printing and part mounting operation by versatilely applying a single wiring board holding device to wiring boards of various layouts for stable support without using a specified backup jig only for such wiring board as one equipped with the same part layout.

There are provided a pin raising/lowering means 24 which utilizes a fluid pressure, backup pins 23 which are supported by the pin raising/ lowering means for vertical movement while individually moved vertically within a prescribed stroke range by the fluid pressure, and lock mechanisms 25 and 26 which fix the rising position when the backup pins reach prescribed rising positions, respectively.


Inventors:
FURUYA HITOSHI
Application Number:
JP2000246966A
Publication Date:
February 28, 2002
Filing Date:
August 16, 2000
Export Citation:
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Assignee:
TOYO COMMUNICATION EQUIP
International Classes:
B41F17/34; B41F17/36; H05K3/34; H05K13/04; (IPC1-7): H05K13/04; B41F17/34; B41F17/36; H05K3/34
Attorney, Agent or Firm:
Suzuki Hitoshi