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Patent Searching and Data


Title:
WIRING CIRCUIT BOARD STRUCTURE HAVING INSPECTION ELECTRODE
Document Type and Number:
Japanese Patent JPH10300819
Kind Code:
A
Abstract:

To prevent the damage of a body to be inspected in inspection and the electric connection reliability with the body to be inspected by constituting the lower insulating resin layer of a conductor wiring pattern extended horizontally from an inspecting electrode electrically connected to a conductor wiring pattern by use of a resin layer having a specified elasticity.

A conductor wiring pattern 6 is extended horizontally from the lower part of an inspection electrode 11, and further connected to a lower conductor wiring pattern 4 in its end part by a via hole 7. An insulating resin layer 5 in the lower part of the conductor wiring pattern 6 is formed of a rubber elastic insulating resin having an elasticity of 106-108 Pa at ordinary temperature. When the elasticity is smaller than 106 Pa, the contact between a body to be inspect and the inspection electrode becomes unstable to reduce the electric connection reliability, and when it is higher than 108 Pa, the body to be inspected is often damaged. Thus, the conductor wiring pattern 6 acts as a spring, and absorbs and disperses the contact pressure when it makes contact with the body to be inspected, so that the damage of the body to be inspected can be prevented.


Inventors:
FUJII KAORU
TSUKAMOTO TAKETO
Application Number:
JP10770597A
Publication Date:
November 13, 1998
Filing Date:
April 24, 1997
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
G01R31/28; H05K3/00; H05K3/46; G01R31/02; (IPC1-7): G01R31/28; G01R31/02; H05K3/00; H05K3/46