WIRING FORMING METHOD - Nippon Telegraph and Telephone Corporation

Title:

WIRING FORMING METHOD

Document Type and Number:

Japanese Patent JP3426550

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To form a wiring finer than that in the prior art uniformly over the entire substrate.
SOLUTION: A resist pattern 103 and a metal paste film 123 are faced and butted each other, a substrate 101 with the resist pattern 103 and the metal paste film 123 faced and butted each other is heated at about 150-200°C as well as a transfer plate 121 is heated to the same temperature, and the semiconductor substrate 101 is pressed to the transfer plate 121 at a pressure of about 980 kPa.

More Like This:

WO/2004/011258	METHOD OF FORMING AND REPAIRING A LITHOGRAPHIC TEMPLATE HAVING A GAP DEFECT
JP2004153269	METHOD FOR FORMING INTERCONNECTION OF SUBSTRATE PENETRATION
JPS51123087	PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE

Inventors:

Katsuyuki Machida
Oku Kuraki
Izuru Iseki
Tsutomu Ueyama

Application Number:

JP33543399A

Publication Date:

July 14, 2003

Filing Date:

November 26, 1999

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Nippon Telegraph and Telephone Corporation
Dainippon Screen Mfg. Co., Ltd.

International Classes:

H01L21/3205; H01L21/288; (IPC1-7): H01L21/3205; H01L21/288

Domestic Patent References:

JP1056060A
JP5206318A

Attorney, Agent or Firm:

Masaki Yamakawa

Previous Patent: CONNECTION STRUCTURE OF EXHAUST PIPE

Next Patent: NOISE PREVENTIVE DEVICE FOR VEHICLE DOOR LATCH DEVICE