Title:
WIRING PATTERN LAYER AND FORMATION THEREOF
Document Type and Number:
Japanese Patent JP3735395
Kind Code:
B2
Abstract:
PURPOSE: To prevent deterioration of electrodeposition adhesive layer and electrodeposition liquid and abnormal deposition of copper by forming an electrodeposition adhesive layer and a conductive layer on a substrate and then forming an ion block layer between the electrodeposition adhesive layer and the conductive layer.
CONSTITUTION: A photoresist layer 112 is formed on a conductive substrate 111 and subjected to exposure and development to form an insulation pattern layer 112'. A pattern of conductive part 111a is then exposed on the conductive substrate 111 and a wiring pattern layer 4, i.e., a conductive layer 30, is formed thereon by plating followed by formation of an ion block layer 20. Subsequently, an insulating adhesive layer 10 is formed by electrodeposotion and a substrate 2 is pressed against the insulating adhesive layer 10. Finally, the conductive substrate 111 is stripped to transfer the wiring pattern layer 4 onto the substrate 2 and the insulating adhesive layer 10 is hardened.
Inventors:
Kenzaburo Kawai
Yoshinuma Hiroto
Yoshinuma Hiroto
Application Number:
JP18356695A
Publication Date:
January 18, 2006
Filing Date:
June 27, 1995
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/20; H01L21/3205; (IPC1-7): H05K3/20; H01L21/3205
Domestic Patent References:
| JP50118255A | ||||
| JP6232538A | ||||
| JP6177494A | ||||
| JP6484690A | ||||
| JP6283842A | ||||
| JP5299820A |
Attorney, Agent or Firm:
Junzo Yoneda
Hideo Sarada
Yoko Hasegawa
Hideo Sarada
Yoko Hasegawa
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