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Title:
WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008258260
Kind Code:
A
Abstract:

To provide a wiring substrate wherein a metal layer having a nano- and micro-pattern is accurately and locally formed, and its manufacturing method.

The method of manufacturing a wiring substrate 100 includes a step to form a sacrifice layer of a first pattern on the substrate 10; a step to form a catalyst layer of a second pattern on the substrate; a step to deposit a metal layer on the catalyst layer of the second pattern by immersing the substrate in a nonelectrolytic plating liquid; and a step to remove the sacrifice layer by heating and to form a metal layer 34 of a third pattern.


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Inventors:
KANEDA TOSHIHIKO
KIMURA SATOSHI
FURUHATA HIDEMICHI
AMAKO ATSUSHI
SAWAKI DAISUKE
KIJIMA TAKESHI
Application Number:
JP2007096398A
Publication Date:
October 23, 2008
Filing Date:
April 02, 2007
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H05K3/18; H05K3/10
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi



 
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