Title:
WOODY FLOOR MATERIAL AND FLOOR STRUCTURE
Document Type and Number:
Japanese Patent JP2016003540
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a direct sticking woody floor material excellent in sound insulation performance and a walking feeling.SOLUTION: A woody floor material of the present invention comprises a plywood base material layer 1 of forming a plurality of reverse grooves 10, a veneer strengthening layer 2 laminated on an upper surface of the plywood base material layer 1, a scratch resistance imparting layer 3 laminated on an upper surface of the strengthening layer 2, a decorative layer 4 laminated on an upper surface of the scratch resistance imparting layer 3 and a sound insulation layer 6 such as a synthetic resin foaming body laminated on an undersurface of the plywood base material layer 1. A thickness of the plywood base material layer 1 is set in 4 mm-8 mm. An upper end position of the reverse groove 10 is set within veneer of a second layer from above in the plywood base material layer 1. The sound insulation layer 6 is set in 2 mm-6 mm in a thickness, and hardness (a JIS K6400-2D method) is also set in 50 N-180 N. A thickness of the whole floor material is set in 6.5 mm-12 mm.
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Inventors:
YUZAKI KATSUYA
IKEDA MICHIHARU
IKEDA MICHIHARU
Application Number:
JP2014126457A
Publication Date:
January 12, 2016
Filing Date:
June 19, 2014
Export Citation:
Assignee:
ASAHI WOODTEC CORP
International Classes:
E04F15/04
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Hisayoshi Shimizu