Title:
WORKPIECE HOLDING DEVICE
Document Type and Number:
Japanese Patent JP2019181630
Kind Code:
A
Abstract:
To provide a workpiece holding device capable of maintaining holding accuracy of a workpiece with high accuracy so as to secure machining accuracy of the workpiece.SOLUTION: A workpiece holding device 5 includes: a workpiece holding section 14 which holds a workpiece and is rotated by rotation of a main shaft 12; a self-supply unit 20 which supplies a workpiece to the workpiece holding section 14; and a control section 30 which can select a supply mode for supplying a workpiece to the workpiece holding section 14 and a polishing mode for polishing the workpiece holding section 14 and the control section 30 which operates the self-supply unit 20 in a first operation when selecting the supply mode and operates the self-supply unit 20 in a second operation different from the first operation when selecting the polishing mode.SELECTED DRAWING: Figure 3
More Like This:
Inventors:
SHINTANI HIROYUKI
UEKI HIDEYASU
NISHITANI KAZUO
UEKI HIDEYASU
NISHITANI KAZUO
Application Number:
JP2018076240A
Publication Date:
October 24, 2019
Filing Date:
April 11, 2018
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
B24B41/06; B23B31/28; B23Q3/10; B23Q3/152; B23Q7/04; B24B45/00
Attorney, Agent or Firm:
Field Saki Satoshi
Shingo Suzuki
Nishizawa Kazumi
Shingo Suzuki
Nishizawa Kazumi