被加工物の加工方法

Title:

被加工物の加工方法

Document Type and Number:

Japanese Patent JP7171139

Kind Code:

B2

Abstract:

To provide a workpiece processing method capable of processing a workpiece without fixing a resin sheet to the workpiece with a paste made of a resin having adhesiveness.SOLUTION: A workpiece processing method includes the steps of: sticking a paste layer side of a resin sheet 21 having a laminate structure in which a paste layer and a base material layer are formed to an annular frame 29 so as to cover an opening of the annular frame in a grinding device 70; forming an unevenness on a surface side of the base material layer on an opposite side of the paste layer; supplying a liquid to a surface side of the base material layer in which the unevenness is formed or a surface side of a workpiece 11; facing the surface of the workpiece and the surface of the base material layer to each other, pressing the workpiece to the resin sheet via the liquid or pressing the resin sheet to the workpiece via the liquid, and fixing the workpiece to the resin sheet in close contact with each other; holding the surface side of the workpiece fixed to the resin sheet; and grinding a rear surface side of the workpiece with a grinding stone 84b of a grinding wheel 84 provided facing a holding surface.SELECTED DRAWING: Figure 11

More Like This:

WO/2015/029577	METHOD FOR PRODUCING LAMINATE, AND LAMINATE
JP2841851	INDUSTRIAL APPLICABILITY: A silicon substrate polishing apparatus and a polishing method.
WO/2019/151145	CHEMICAL MECHANICAL POLISHING COMPOSITION AND POLISHING METHOD

Inventors:

Yousuke Murata
Kazuhiro Koike

Application Number:

JP2018231763A

Publication Date:

November 15, 2022

Filing Date:

December 11, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Disco Co., Ltd.

International Classes:

H01L21/304; B24B7/04; B24B37/30; B24B41/06; C09J7/20; C09J7/30; C09J201/00; H01L21/683

Domestic Patent References:

JP2011011304A
JP10146755A
JP2014038877A
JP11188617A
JP2018182129A
JP2013179120A
JP2004134538A
JP2001277109A
JP4996767B1
JP5127990B1

Attorney, Agent or Firm:

Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano

Previous Patent: Device chip manufacturing method

Next Patent: Workpiece processing method and resin sheet unit