Title:
WORKPIECE PROCESSING SHEET, WORKPIECE PROCESSING METHOD, AND USE OF WORKPIECE PROCESSING SHEET
Document Type and Number:
Japanese Patent JP2023093908
Kind Code:
A
Abstract:
To provide a workpiece processing sheet excellent in expandability and low friction.SOLUTION: A workpiece processing sheet 1 includes a substrate 11, and an adhesive layer 12 laminated on one surface side of the substrate 11. In the workpiece processing sheet 1, a fluorine atomic ratio measured by X-ray photoelectron spectroscopy (XPS) in a surface on the opposite side to the adhesive layer 12 of the substrate 11 is 0.01 atm% or more and 2.5 atm% or less.SELECTED DRAWING: Figure 1
Inventors:
OZEKI REO
TSUCHIYAMA SAYAKA
TSUCHIYAMA SAYAKA
Application Number:
JP2021209036A
Publication Date:
July 05, 2023
Filing Date:
December 23, 2021
Export Citation:
Assignee:
LINTEC CORP
International Classes:
C09J7/38; C09J201/00; H01L21/301
Attorney, Agent or Firm:
Yuji Hayakawa
Keisuke Murasame
Rikei Iida
Keisuke Murasame
Rikei Iida
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