Title:
The adhesion fiber for using it for the deployment in a lumen of an extensible implant
Document Type and Number:
Japanese Patent JP6081994
Kind Code:
B2
Abstract:
The present disclosure describes treatment of the vasculature of a patient with an expandable implant. The implant is constrained to a reduced delivery diameter for delivery within the vasculature by at least one sleeve. The implant can be constrained to other diameters, such as an intermediate diameter. The sleeves can be expanded, allowing for expansion of the diameter of the expandable implant, by disengaging a coupling member from the sleeve or sleeves from outside of the body of the patient. The expandable implant can comprise an apposition line or lines which facilitate bending of the expandable implant to improve conformation of the expandable implant to the vasculature of the patient.
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Inventors:
Patrick M. Norris
Joseph M. Biscocil
Joseph M. Biscocil
Application Number:
JP2014515995A
Publication Date:
February 15, 2017
Filing Date:
June 14, 2012
Export Citation:
Assignee:
W.L. GORE & ASSOCIATES, INCORPORATED
International Classes:
A61F2/97; A61F2/07; A61M25/00
Domestic Patent References:
| JP2002503114A | ||||
| JP2010506605A | ||||
| JP2002518086A | ||||
| JP2011511693A | ||||
| JP2004188219A | ||||
| JP2014502180A | ||||
| JP2014501563A | ||||
| JP2014501565A | ||||
| JP2014533189A |
Foreign References:
| WO2010063795A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Fukumoto product
Tetsuji Koga
Yoichi Watanabe
Masaru Nakajima
Michiko Uehara
Takashi Ishida
Fukumoto product
Tetsuji Koga
Yoichi Watanabe
Masaru Nakajima
Michiko Uehara