Title:
装置
Document Type and Number:
Japanese Patent JP6559820
Kind Code:
B2
Abstract:
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
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Inventors:
Shingo Eguchi
Youma
Atsuhiro Tani
Hirosue Misako
Kenichi Hashimoto
Yasushi Hosaka
Youma
Atsuhiro Tani
Hirosue Misako
Kenichi Hashimoto
Yasushi Hosaka
Application Number:
JP2018027667A
Publication Date:
August 14, 2019
Filing Date:
February 20, 2018
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/02; B23K26/351; H01L27/12
Domestic Patent References:
| JP2006060196A | ||||
| JP2006202820A | ||||
| JP2006259095A | ||||
| JP2005079553A | ||||
| JP2004311955A | ||||
| JP2002169014A |