PURPOSE: To enable the dissolution of zinc faster than heretofore without entailing the pollution of a plating liquid by dissolving a zinc chip while bringing the zinc chip into contact with Ti and/or Nb in a plating bath.
CONSTITUTION: The Ti and/or Nb has the potential nobler than the potential of zinc and accelerates the generation of gaseous hydrogen when the zinc is brought into contact therewith in the bath. The dissolution rate of the zinc chip is then extremely increased. In addition, the zinc hardly elutes into the Ti and Nb plating bath and does not contaminate the plating bath. The dissolution rate of 1.5 to 1.7 times higher than the dissolution rate of the conventional method is confined when the dissolution rates y at the time of forming a basket for dissolving the zinc chip of a stainless steel like heretofore and at the time of forming the basket of Ti, Ti+Nb or Nb are compared.
HONJO TORU
YAMATO KOJI
