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Title:
MATERIAL FOR FORMING SILICON-CONTAINING FILM AND PATTERN FORMATION METHOD
Document Type and Number:
Japanese Patent JP2017097240
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a novel material for forming a silicon-containing film good in detachability during conducting wet detachment using an acidic liquid.SOLUTION: There is provided a material for forming silicon-containing film used in a pattern formation method having a process for applying a silicon-containing film material on a substrate to form a silicon-containing film, a process for forming a pattern with the silicon-containing film as a mask and a process for contacting the silicon-containing film with an acidic liquid and containing (A) a siloxane-based polymer containing a constitutional unit represented by the formula (1) and (B) an organic solvent. (1), where Ris a monovalent organic group having a crosslinkable group, Ris a monovalent organic group having the crosslinkable group, a hydrogen atom, a hydroxyl group, a substituted or unsubstituted non-crosslinkable hydrocarbon group with 1 to 20 carbon atoms and l is 0 or 1.SELECTED DRAWING: None

Inventors:
ANNO YUSUKE
SEKO TOMOAKI
OTSUBO YUSUKE
Application Number:
JP2015231028A
Publication Date:
June 01, 2017
Filing Date:
November 26, 2015
Export Citation:
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Assignee:
JSR CORP
International Classes:
G03F7/11; C08G77/04; G03F7/26; H01L21/027
Domestic Patent References:
JP2007163846A2007-06-28
JP2007178455A2007-07-12
JP2009237363A2009-10-15
JP2010085912A2010-04-15
JP2013067798A2013-04-18
JPS62269140A1987-11-21
Foreign References:
WO2013146600A12013-10-03
WO2015146749A12015-10-01
WO2012117948A12012-09-07
US20100255427A12010-10-07
Attorney, Agent or Firm:
Kaoru Watanabe
Miwako Inoue